Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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01/21/2020
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Application #:
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15903799
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Filing Dt:
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02/23/2018
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Publication #:
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Pub Dt:
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09/06/2018
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Inventors:
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Laura Mauer, John Taddei, Kenji Nulman, John Clark
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Title:
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APPARATUS AND METHOD FOR WAFER THINNING IN ADVANCED PACKAGING APPLICATIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 185 GIBRALTAR ROAD |
| HORSHAM, PENNSYLVANIA 19044 |
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| LEASON ELLIS LLP |
| ONE BARKER AVENUE |
| FIFTH FLOOR |
| WHITE PLAINS, NY 10601 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 185 GIBRALTAR ROAD |
| HORSHAM, PENNSYLVANIA 19044 |
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| LEASON ELLIS LLP |
| ONE BARKER AVENUE |
| FIFTH FLOOR |
| WHITE PLAINS, NY 10601 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 TERMINAL DRIVE |
| PLAINVIEW, NEW YORK 11803 |
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| ALAN P KASS |
| 394 ELIZABETH AVENUE |
| SOMERSET, NJ 08873 |
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Assignment:
4
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PATENT SECURITY AGREEMENT
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| 95 WASHINGTON STREET, FLOOR 2SOUTH |
| BUFFALO, NEW YORK 14203 |
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| LINDA A. SALERA, SENIOR PARALEGAL |
| ONE FEDERAL STREET |
| C/O MORGAN, LEWIS & BOCKIUS LLP |
| BOSTON, MA 02110 |
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