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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/28/2020
Application #:
15909431
Filing Dt:
03/01/2018
Publication #:
Pub Dt:
11/08/2018
Inventors:
Wayne C. Long, Joseph L. Nguyen, Joe A. Ojeda
Title:
METHOD AND STRUCTURE FOR PREVENTING SOLDER FLOW INTO A MEMS PRESSURE PORT DURING MEMS DIE ATTACHMENT
Assignment: 1
Reel/Frame:
045089/0642Recorded: 03/02/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/15/2017
Exec Dt:
06/15/2017
Exec Dt:
06/15/2017
Assignee:
4120 FREIDRICH LANE
SUITE 225
AUSTIN, TEXAS 78744
Correspondent:
MACMILLAN, SOBANSKI & TODD, LLC
720 WATER STREET
ONE MARITIME PLAZA, FIFTH FLOOR
TOLEDO, OH 43604

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