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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10546731
Issue Dt:
01/28/2020
Application #:
16153650
Filing Dt:
10/05/2018
Inventors:
MICHAEL G. CHAFIN, HAITAO WANG, KARTIK RAMASWAMY, VALENTIN TODOROW, SERGIO F. SHOJI et al
Title:
METHOD, APPARATUS AND SYSTEM FOR WAFER DECHUCKING USING DYNAMIC VOLTAGE SWEEPING
Assignment: 1
Reel/Frame:
047563/0732Recorded: 11/21/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WANG, HAITAO
Exec Dt:
10/10/2018
CHAFIN, MICHAEL
Exec Dt:
10/10/2018
RAMASWAMY, KARTIK
Exec Dt:
10/10/2018
GUO, YUE
Exec Dt:
10/10/2018
TODOROW, VALENTIN
Exec Dt:
10/10/2018
DOAN, KENNY
Exec Dt:
10/10/2018
SHOJI, SERGIO F.
Exec Dt:
10/10/2018
MAYS, BRAD L.
Exec Dt:
10/19/2018
DADU, USAMA
Exec Dt:
11/02/2018
Assignee:
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
MOSER TABOADA/ALAN TABOADA
1030 BROAD STREET
SUITE 203
SHREWSBURY, NJ 07702

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