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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/28/2020
Application #:
15474276
Filing Dt:
03/30/2017
Publication #:
Pub Dt:
03/15/2018
Inventors:
Kyoung Whan OH, Yeon Woo CHOI, Won Yup KO, Min Seok MOON, Won Ki PARK, Seung Hwan LEE et al
Title:
WAFER PERFORATING DEVICE
Assignment: 1
Reel/Frame:
041798/0804Recorded: 03/30/2017Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/15/2017
Exec Dt:
03/15/2017
Exec Dt:
03/15/2017
Exec Dt:
03/20/2017
Exec Dt:
03/15/2017
Exec Dt:
03/15/2017
Exec Dt:
03/15/2017
Assignee:
129, SAMSUNG-RO
YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
MYERS BIGEL, P.A.
PO BOX 37428
RALEIGH, NC 27627

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