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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/04/2020
Application #:
16085205
Filing Dt:
09/14/2018
Publication #:
Pub Dt:
03/28/2019
Inventors:
Satohiko HOSHINO, Mitsumasa KOYANAGI, Shinya KIKUTA, Takafumi FUKUSHIMA, Kangwook LEE
Title:
METHOD FOR ALIGNING CHIP COMPONENTS RELATIVE TO SUBSTRATE BY USING LIQUID
Assignment: 1
Reel/Frame:
047046/0979Recorded: 10/03/2018Pages: 17
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/28/2018
Exec Dt:
08/28/2018
Exec Dt:
09/13/2018
Exec Dt:
09/13/2018
Exec Dt:
08/24/2018
Assignees:
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU
TOKYO, JAPAN 107-6325
2-1-1, KATAHIRA, AOBA-KU
SENDAI-SHI, MIYAGI, JAPAN 9808577
Correspondent:
NATH, GOLDBERG & MEYER
112 S. WEST ST.
36076U_JLM/ALS
ALEXANDRIA, VA 22314

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