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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/04/2020
Application #:
15959661
Filing Dt:
04/23/2018
Publication #:
Pub Dt:
10/25/2018
Inventors:
Thomas Aichinger, Daniel Kueck, Ralf Siemieniec, Romain Esteve
Title:
SiC Semiconductor Device with Offset in Trench Bottom
Assignment: 1
Reel/Frame:
048548/0224Recorded: 03/08/2019Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/19/2018
Exec Dt:
03/08/2019
Exec Dt:
04/24/2018
Exec Dt:
04/24/2018
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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