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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/18/2020
Application #:
15653681
Filing Dt:
07/19/2017
Publication #:
Pub Dt:
01/25/2018
Inventors:
Myron Samila, Tak-Man (Dennis) Loui
Title:
COIL MODULE ASSEMBLY WITH THERMALLY DECOUPLED SOLENOID AND CIRCUIT
Assignment: 1
Reel/Frame:
043042/0025Recorded: 07/19/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/27/2016
Exec Dt:
07/27/2016
Assignee:
50 CASMIR COURT
CONCORD, CANADA L4K 4J5
Correspondent:
DICKINSON WRIGHT PLLC
2600 W. BIG BEAVER RD., SUITE 300
TROY, MI 48084-3312

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