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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/18/2020
Application #:
15284580
Filing Dt:
10/04/2016
Publication #:
Pub Dt:
04/05/2018
Inventors:
Thorsten Meyer, Gerald Ofner, Peter Scherl, Stephan Bradl, Stefan Miethaner et al
Title:
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
Assignment: 1
Reel/Frame:
040198/0333Recorded: 11/02/2016Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/05/2016
Exec Dt:
10/05/2016
Exec Dt:
10/07/2016
Exec Dt:
10/04/2016
Exec Dt:
10/10/2016
Exec Dt:
10/07/2016
Exec Dt:
10/04/2016
Assignee:
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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