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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10581587
Issue Dt:
03/03/2020
Application #:
16397848
Filing Dt:
04/29/2019
Inventors:
Varun Gupta, Milam Paraschou, Gerald R. Talbot, Gurunath Dollin, Damon Tohidi et al
Title:
DESKEWING METHOD FOR A PHYSICAL LAYER INTERFACE ON A MULTI-CHIP MODULE
Assignment: 1
Reel/Frame:
049507/0825Recorded: 06/18/2019Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
GUPTA, VARUN
Exec Dt:
05/03/2019
PARASCHOU, MILAM
Exec Dt:
05/01/2019
TALBOT, GERALD R.
Exec Dt:
05/29/2019
DOLLIN, GURUNATH
Exec Dt:
05/06/2019
CARPENTER, ERIC IAN
Exec Dt:
05/01/2019
GALLUN, CHAD S.
Exec Dt:
05/01/2019
COOPER, JEFFREY
Exec Dt:
05/01/2019
CHO, HANWOO
Exec Dt:
06/17/2019
LIKENS, THOMAS H., III
Exec Dt:
05/06/2019
DOW, SCOTT F.
Exec Dt:
05/02/2019
TRESIDDER, MICHAEL J.
Exec Dt:
05/31/2019
Assignee:
ADVANCED MICRO DEVICES, INC.
2485 AUGUSTINE DRIVE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
MEYERTONS HOOD KIVLIN KOWERT & GOETZEL
P.O. BOX 398
AUSTIN, TX 78767-0398
Assignment: 2
Reel/Frame:
049507/0897Recorded: 06/18/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
TOHIDI, DAMON
Exec Dt:
05/13/2019
Assignee:
ATI TECHNOLOGIES ULC
ONE COMMERCE VALLEY DRIVE EAST
MARKHAM, CANADA
Correspondent:
MEYERTONS HOOD KIVLIN KOWERT & GOETZEL
P.O. BOX 398
AUSTIN, TX 78767-0398

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