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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/03/2020
Application #:
16392595
Filing Dt:
04/23/2019
Publication #:
Pub Dt:
08/15/2019
Inventors:
Mingzhu WANG, Takehiko Tanaka, Bojie ZHAO, Nan GUO, Heng JIANG, Zhenyu CHEN, Zhongyu LUAN et al
Title:
Photosensitive Assembly and Camera Module and Manufacturing Method Thereof
Assignment: 1
Reel/Frame:
054022/0010Recorded: 10/09/2020Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/17/2019
Exec Dt:
06/10/2019
Exec Dt:
06/10/2019
Exec Dt:
06/11/2019
Exec Dt:
06/10/2019
Exec Dt:
06/10/2019
Exec Dt:
06/10/2019
Exec Dt:
06/10/2019
Exec Dt:
06/10/2019
Exec Dt:
06/10/2019
Assignee:
66-68 SHUNYU ROAD,
YUYAO CITY, NINGBO, ZHEJIANG PROVINCE, CHINA 315400
Correspondent:
RAYMOND Y CHAN
108 N. YNEZ AVE., SUITE 128
MONTEREY PARK, CA 91754

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