Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/17/2020
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Application #:
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15525811
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Filing Dt:
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05/10/2017
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Publication #:
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Pub Dt:
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11/15/2018
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Inventors:
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Hiroaki NAGATA, Eiji MURASE, Toshikazu SHIMIZU
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Title:
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Au-Sn-Ag-BASED SOLDER ALLOY AND SOLDER MATERIAL, ELECTRONIC COMPONENT SEALED WITH THE SAME Au-Sn-Ag BASED SOLDER ALLOY OR SOLDER MATERIAL, AND ELECTRONIC COMPONENT MOUNTING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-3, SHIMBASHI 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8716 |
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| WENDEROTH, LIND & PONACK, L.L.P. |
| 1030 15TH STREET, NW |
| SUITE 400 EAST |
| WASHINGTON, DC 20005 |
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