Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
03/17/2020
|
Application #:
|
15708947
|
Filing Dt:
|
09/19/2017
|
|
Publication #:
|
|
Pub Dt:
|
10/25/2018
| | | | |
|
Inventors:
|
Young Jin HA, Hyun Ju JUNG, So Young JUN, Jeong Hwan IM, Sung Jin PARK
|
|
Title:
|
MULTILAYER CHIP BEAD
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
|
|
|
|
| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
|
|
Search Results as of:
05/08/2024 12:16 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
