Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
03/24/2020
|
Application #:
|
15801763
|
Filing Dt:
|
11/02/2017
|
|
Publication #:
|
|
Pub Dt:
|
05/02/2019
| | | | |
|
Inventors:
|
Toyohiro Aoki, Takashi Hisada, Masao Tokunari, Eiji Nakamura
|
|
Title:
|
FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BUMP AND INJECTION MOLDED SOLDER, AND FLIP CHIP JOINING WITH THE SOLDER BUMP
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
|
|
|
|
| TUTUNJIAN & BITETTO, P.C. |
| 401 BROADHOLLOW ROAD, SUITE 402 |
| MELVILLE, NY 11747 |
|
|
Search Results as of:
04/29/2024 08:56 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
