Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/31/2020
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Application #:
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16529002
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Filing Dt:
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08/01/2019
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Inventors:
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Anson J. Call, Sushumna Iruvanti, Shidong Li, Brian W. Quinlan, Kamal K. Sikka, Rui Wang
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Title:
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Reduction of Laminate Failure in Integrated Circuit (IC) Device Carrier
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| ZIP GROUP PLLC - IBM FIS |
| 610 KINGSVIEW LN N |
| MINNEAPOLIS, MN 55447 |
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