Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/31/2020
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Application #:
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15803053
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Filing Dt:
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11/03/2017
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Publication #:
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Pub Dt:
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03/01/2018
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Inventors:
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Toyohiro Aoki, Takashi Hisada, Eiji I. Nakamura
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Title:
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METHOD OF FORMING A SOLDER BUMP STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| TUTUNJIAN & BITETTO, P.C. |
| 401 BROADHOLLOW ROAD, SUITE 402 |
| MELVILLE, NY 11747 |
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