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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10610979
Issue Dt:
04/07/2020
Application #:
15988257
Filing Dt:
05/24/2018
Publication #:
20180339375
Pub Dt:
11/29/2018
Inventors:
Daisuke Maruko, Atsumi Takahashi, Hiroki Sudo, Hiroyoshi Kawasaki, Takahiro Hattori et al
Title:
Flux Composition for Solder Applications
Assignment: 1
Reel/Frame:
045894/0118Recorded: 05/24/2018Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
MARUKO, DAISUKE
Exec Dt:
04/27/2018
TAKAHASHI, ATSUMI
Exec Dt:
04/27/2018
SUDO, HIROKI
Exec Dt:
05/22/2018
KAWASAKI, HIROYOSHI
Exec Dt:
05/22/2018
HATTORI, TAKAHIRO
Exec Dt:
05/22/2018
ROPPONGI, TAKAHIRO
Exec Dt:
05/22/2018
SOMA, DAISUKE
Exec Dt:
05/22/2018
HAGIWARA, TAKASHI
Exec Dt:
04/27/2018
SATO, ISAMU
Exec Dt:
05/22/2018
KAWAMATA, YUJI
Exec Dt:
05/22/2018
Assignee:
SENJU METAL INDUSTRY CO., LTD.
23, SENJU-HASHIDO-CHO, ADACHI-KU
TOKYO, JAPAN 120-8555
Correspondent:
THE WEBB LAW FIRM, P.C.
ONE GATEWAY CENTER
420 FT. DUQUESNE BLVD, SUITE 1200
PITTSBURGH, PA 15222

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