Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/07/2020
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Application #:
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14929479
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Filing Dt:
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11/02/2015
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Publication #:
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Pub Dt:
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05/05/2016
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Inventors:
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Arunava Majumdar, Seid H. Sadat, Dusan Coso
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Title:
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INTERPOSER FOR MULTI-CHIP ELECTRONICS PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3000 EL CAMINO REAL |
| BUILDING FIVE, THIRD FLOOR |
| PALO ALTO, CALIFORNIA 94306-1106 |
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| KAPLAN BREYER SCHWARZ & OTTESEN, LLP |
| 100 MATAWAN ROAD, SUITE 120 |
| MATAWAN, NJ 07747 |
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