Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/14/2020
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Application #:
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16266118
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Filing Dt:
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02/04/2019
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Inventors:
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Ryo Hosoi, Takashi Honda, Makoto Kawato
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Title:
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THERMALLY-ASSISTED MAGNETIC RECORDING HEAD CAPABLE OF PREVENTING SOLDER OVERFLOW DURING MANUFACTURING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T. |
| HONG KONG, HONG KONG |
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| BYIP |
| P.O. BOX 1484 |
| GENERAL POST OFFICE |
| HONG KONG, CHINA |
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