Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/21/2020
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Application #:
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13999284
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Filing Dt:
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02/06/2014
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Publication #:
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Pub Dt:
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06/12/2014
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Inventors:
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Iver E. Anderson, Kathlene Nicole Reeve
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Title:
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Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder
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Assignment:
1
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CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
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| 1000 INDEPENDENCE AVE., S.W. |
| WASHINGTON, DISTRICT OF COLUMBIA 20585 |
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| MICHAEL J. DOBBS |
| U. S. DEPT. OF ENERGY, IPLD |
| 9800 S. CASS AVE |
| ARGONNE, IL 60439 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1805 COLLABORATION PLACE, SUITE 2100 |
| AMES, IOWA 50010 |
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| EDWARD J. TIMMER |
| 526 W. 14TH STREET |
| TRAVERSE CITY, MI 49684 |
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Assignment:
3
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CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
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| 1000 INDEPENDENCE AVE. S.W. |
| WASHINGTON, DISTRICT OF COLUMBIA 20585 |
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| TIMOTHY L HARNEY |
| 9800 S. CASS AVE |
| IPLD |
| ARGONNE, IL 60439 |
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