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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/21/2020
Application #:
15501800
Filing Dt:
02/03/2017
Publication #:
Pub Dt:
12/21/2017
Inventors:
Hitoshi Kaneko, Yoko Horikoshi, Akira Miyama, Toru Arai, Ayumu Tsukamoto
Title:
CONDUCTIVE POLYMER MATERIAL AND MOLDED ARTICLE USING SAME
Assignment: 1
Reel/Frame:
046094/0457Recorded: 06/14/2018Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/23/2018
Exec Dt:
04/17/2018
Exec Dt:
04/20/2018
Exec Dt:
04/20/2018
Exec Dt:
04/20/2018
Assignee:
1-1, NIHONBASHI-MUROMACHI 2-CHOME
CHUO-KU, TOKYO, JAPAN 1038338
Correspondent:
LLEWELLYN RHYS LAWSON, PH.D.
CHRISTENSEN O'CONNOR JOHNSON KINDNESS
1201 THIRD AVENUE, SUITE 3600
SEATTLE, WA 98101-3029

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