Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
04/21/2020
|
Application #:
|
15938271
|
Filing Dt:
|
03/28/2018
|
|
Publication #:
|
|
Pub Dt:
|
05/30/2019
| | | | |
|
Inventors:
|
Chi-Rui Wu, Fu-Tang Huang, Chia-Cheng Chen, Chun-Hsien Lin, Hsuan-Hao Mi, Yu-Cheng Pai
|
|
Title:
|
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 123, SEC. 3, DAFENG RD., TANTZI DIST. |
| TAICHUNG CITY, TAIWAN 427 |
|
|
|
|
| MINTZ LEVIN |
| ONE FINANCIAL CENTER |
| BOSTON, MA 02111 |
|
|
Search Results as of:
05/17/2024 08:00 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
