Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/28/2020
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Application #:
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16106679
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Filing Dt:
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08/21/2018
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Publication #:
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Pub Dt:
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02/27/2020
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Inventors:
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Junjing Bao, Jie Deng, John Zhu, Giridhar Nallapati
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Title:
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STRUCTURE AND METHOD OF METAL WRAPAROUND FOR LOW VIA RESISTANCE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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