Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/05/2020
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Application #:
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15846800
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Filing Dt:
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12/19/2017
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Publication #:
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Pub Dt:
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04/19/2018
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Inventors:
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Hiroshi AKIMOTO, Takushi YOSHIDA
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Title:
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LEAD BONDING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-8, DOGENZAKA 1-CHOME, SHIBUYA-KU |
| TOKYO, JAPAN 150-0043 |
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| MAIER & MAIER, PLLC |
| 345 SOUTH PATRICK STREET |
| ALEXANDRIA, VA 22314 |
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