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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/19/2020
Application #:
15756642
Filing Dt:
03/01/2018
Publication #:
Pub Dt:
08/30/2018
Inventor:
Tatsuya FUKUDA
Title:
MOLDING DIE DEVICE AND MOLDING METHOD
Assignment: 1
Reel/Frame:
045073/0812Recorded: 03/01/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/22/2018
Assignee:
598-1, TATSUMAE-CHO, NAKADACHIURISAGARU
KARASUMA-DORI, KAMIGYO-KU
KYOTO-SHI, KYOTO, JAPAN 602-0912
Correspondent:
TROUTMAN SANDERS
875 THIRD AVENUE
NEW YORK, NY 10022

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