Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/19/2020
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Application #:
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16057792
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Filing Dt:
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08/07/2018
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Publication #:
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Pub Dt:
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02/14/2019
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Inventors:
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Antonio Bambalan DIMAANO JR., Nataporn CHARUSABHA, Saravuth SIRINORAKUL et al
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Title:
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SEMICONDUCTOR PACKAGE WITH A HEAT SPREADER AND METHOD OF MANUFACTURING THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE LTD |
| 7500A BEACH ROAD |
| #04-306/308 THE PLAZA |
| SINGAPORE 199591, SINGAPORE |
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