Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/19/2020
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Application #:
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15920780
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Filing Dt:
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03/14/2018
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Publication #:
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Pub Dt:
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03/21/2019
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Inventors:
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Akira Kimitsuka, Mariko Habu, Hidekazu Inoto, Takeshi Yamamoto, Kanji Osari
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Title:
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SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, INTEGRATED CIRCUIT DEVICE, AND METHOD FOR MANUFACTURING INTERGRATED CIRCUIT DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN 105-8001 |
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| 1-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN 105-0023 |
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| WHITE & CASE LLP |
| 701 THIRTEENTH STREET, NW |
| WASHINGTON, DC 20005-3807 |
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