Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
05/19/2020
|
Application #:
|
15616525
|
Filing Dt:
|
06/07/2017
|
|
Publication #:
|
|
Pub Dt:
|
01/25/2018
| | | | |
|
Inventors:
|
WON-GIL HAN, SANGHO AN, YONG JE LEE, JAE HEUNG LEE, SEUNGWEON HA
|
|
Title:
|
BONDING WIRE HAVING A SILVER ALLOY CORE, WIRE BONDING METHOD USING THE BONDING WIRE, AND ELECTRICAL CONNECTION PART OF SEMICONDUCTOR DEVICE USING THE BONDING WIRE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
|
|
|
|
| F. CHAU & ASSOCIATES, LLC |
| 130 WOODBURY ROAD |
| WOODBURY, NY 11797 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
CORRECTIVE ASSIGNMENT TO ADD OMITTED FIFTH ASSIGNOR'S DATA PREVIOUSLY RECORDED ON REEL 042638 FRAME 0685. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
|
|
|
|
|
|
|
|
|
| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
|
|
|
|
| F. CHAU & ASSOCIATE, INC. |
| 130 WOODBURY ROAD |
| WOODBURY, NY 11797 |
|
|
Search Results as of:
05/20/2024 02:56 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
