Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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05/26/2020
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Application #:
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16284323
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Filing Dt:
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02/25/2019
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Publication #:
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Pub Dt:
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09/05/2019
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Inventor:
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Fumimasa HORIKIRI
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Title:
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GaN MATERIAL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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880, ISAGOZAWA-CHO, HITACHI-SHI |
IBARAKI, JAPAN 3191418 |
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27-1, SHINKAWA 2-CHOME, CHUO-KU |
TOKYO, JAPAN 1048260 |
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PEARNE & GORDON LLP |
1801 EAST 9TH STREET |
SUITE 1200 |
CLEVELAND, OH 44114 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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ONE BOSTON PLACE, 18TH FLOOR |
BOSTON, MASSACHUSETTS 02108 |
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JENNIFER TINDIE |
1025 VERMONT AVE NW, SUITE 1130 |
COGENCY GLOBAL INC. |
WASHINGTON, DC 20005 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 050010 FRAME: 0234. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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ONE BOSTON PLACE, 18TH FLOOR |
BOSTON, MASSACHUSETTS 02108 |
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JENNIFER TINDIE |
1025 VERMONT AVE NW, SUITE 1130 |
COGENCY GLOBAL INC. |
WASHINGTON, DC 20005 |
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Assignment:
4
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MERGER (SEE DOCUMENT FOR DETAILS).
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2-7-1, NIHONBASHI, CHUO-KU |
TOKYO, JAPAN 103-6020 |
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PEARNE & GORDON LLP |
1801 E. 9TH STREET |
SUITE 1200 |
CLEVELAND, OH 44114-3108 |
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05/11/2024 04:20 PM
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