skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total Assignments: 1
Patent #:
10670946
Issue Dt:
06/02/2020
Application #:
16157082
Filing Dt:
10/10/2018
Publication #:
20190041727
Pub Dt:
02/07/2019
Inventors:
Bojie ZHAO, Nan GUO, Heng JIANG, Liang DING, Mingzhu WANG, Takehiko TANAKA, Zhenyu CHEN et al
Title:
Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device
Assignment: 1
Reel/Frame:
048743/0029Recorded: 03/28/2019Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WANG, MINGZHU
Exec Dt:
02/18/2019
ZHAO, BOJIE
Exec Dt:
02/21/2019
TANAKA, TAKEHIKO
Exec Dt:
02/14/2019
GUO, NAN
Exec Dt:
02/13/2019
HUANG, ZHEN
Exec Dt:
02/14/2019
CHENG, DUANLIANG
Exec Dt:
02/14/2019
DING, LIANG
Exec Dt:
02/13/2019
CHEN, FEIFAN
Exec Dt:
02/13/2019
JIANG, HENG
Exec Dt:
02/13/2019
CHEN, ZHENYU
Exec Dt:
02/13/2019
Assignee:
NINGBO SUNNY OPOTECH CO., LTD.
66-68, SHUNYU ROAD, YUYAO,
NINGBO, ZHEJIANG, CHINA 315400
Correspondent:
DAVID AND RAYMOND PATENT FIRM
108 N. YNEZ AVE., SUITE 128
MONTEREY PARK, CA 91754

Search Results as of: 05/02/2024 02:52 PM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT