Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/02/2020
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Application #:
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15005275
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Filing Dt:
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01/25/2016
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Publication #:
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Pub Dt:
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05/19/2016
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Inventors:
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Venkatesh Sundaram, Fuhan Liu, Rao R. Tummala, Qiao Chen, Vivek Sridharan et al
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Title:
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THROUGH-PACKAGE-VIA (TPV) STRUCTURES ON INORGANIC INTERPOSER AND METHODS FOR FABRICATING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 505 TENTH STREET, NW |
| ATLANTA, GEORGIA 30332-0415 |
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| TROUTMAN SANDERS LLP |
| 600 PEACHTREE STREET |
| SUITE 5200 |
| ATLANTA, GA 30308 |
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