Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/09/2020
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Application #:
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16167501
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Filing Dt:
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10/22/2018
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Publication #:
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Pub Dt:
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03/26/2020
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Inventors:
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Purakh Raj Verma, Kuo-Yuh Yang, Chia-Huei Lin
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Title:
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SEMICONDUCTOR STRUCTURE WITH HIGH RESISTIVITY WAFER AND FABRICATING METHOD OF BONDING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU CITY, TAIWAN |
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| WINSTON HSU |
| 5F., NO.389, FUHE RD., YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN |
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