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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10692908
Issue Dt:
06/23/2020
Application #:
16203754
Filing Dt:
11/29/2018
Publication #:
20190198545
Pub Dt:
06/27/2019
Inventors:
Chen-Hsin WU, Liang-Chih WENG, Hao-Che LIU, Chien-Yao HUANG, Sau-Mou WU, Yu-Hsiang PAN et al
Title:
CMOS Image Sensor Encapsulation Structure and Method for Manufacturing the Same
Assignment: 1
Reel/Frame:
047649/0784Recorded: 12/03/2018Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WU, CHEN-HSIN
Exec Dt:
11/15/2018
LIN, LIU-YUH
Exec Dt:
11/15/2018
WENG, LIANG-CHIH
Exec Dt:
11/15/2018
CHENG, TZU-HUAN
Exec Dt:
11/15/2018
LIU, HAO-CHE
Exec Dt:
11/15/2018
LIU, CHIEN-CHUN
Exec Dt:
11/15/2018
HUANG, CHIEN-YAO
Exec Dt:
11/15/2018
CHIU, LEON A
Exec Dt:
11/15/2018
WU, SAU-MOU
Exec Dt:
11/15/2018
TAI, TI-HSIEN
Exec Dt:
11/15/2018
PAN, YU-HSIANG
Exec Dt:
11/15/2018
Assignee:
PIONEER MATERIALS INC. CHENGDU
NO. 88, BAICAO STREET
WEST HIGH-TECH DEVELOPMENT ZONE
CHENGDU, SICHUAN, CHINA 611730
Correspondent:
BERGGREN LLP
ONE GATEWAY CENTER, SUITE 2600
NEWARK, NJ 07102

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