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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/30/2020
Application #:
16505405
Filing Dt:
07/08/2019
Publication #:
Pub Dt:
10/31/2019
Inventors:
Yang-Che CHEN, Tsung-Te CHOU, Chen-Hua LIN, Huang-Wen TSENG, Chwen-Ming LIU
Title:
METHOD OF DETECTING DELAMINATION IN AN INTEGRATED CIRCUIT PACKAGE STRUCTURE
Assignment: 1
Reel/Frame:
049704/0581Recorded: 07/09/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/14/2017
Exec Dt:
02/14/2017
Exec Dt:
02/14/2017
Exec Dt:
02/14/2017
Exec Dt:
02/20/2017
Assignee:
NO.8, LI-HSIN RD.6
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
R. BURNS ISRAELSEN
MASCHOFF BRENNAN
1389 CENTER DR. SUITE 300
PARK CITY, UT 84098

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