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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	10699978	Issue Dt:	06/30/2020	Application #:	16124448	Filing Dt:	09/07/2018
Publication #:	20190080973	Pub Dt:	03/14/2019
Inventors:	Ralf Otremba, Amirul Afiq Hud, Teck Sim Lee, Xaver Schloegel, Bernd Schmoelzer
Title:	SMD Package with Top Side Cooling

Assignment: 1

Reel/Frame:

049381/0565

Recorded: 06/05/2019

Pages: 9

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

OTREMBA, RALF

Exec Dt:

09/10/2018

HUD, AMIRUL AFIQ

Exec Dt:

04/12/2019

SIM LEE, TECK

Exec Dt:

05/29/2019

SCHLOEGEL, XAVER

Exec Dt:

09/10/2018

SCHMOELZER, BERND

Exec Dt:

09/10/2018

Assignee:

INFINEON TECHNOLOGIES AUSTRIA AG

SIEMENSSTRASSE 2

VILLACH, AUSTRIA 9500

Correspondent:

MURPHY, BILAK & HOMILLER/INFINEON TECHNO

1255 CRESCENT GREEN

SUITE 200

CARY, NC 27518

Assignment: 2

Reel/Frame:

051530/0934

Recorded: 06/26/2019

Pages: 12

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR TECK SIM LEE'S LAST NAME PREVIOUSLY RECORDED ON REEL 049381 FRAME 0565. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNOR LAST NAME SHOULD BE LEE, NOT SIM LEE.

Assignors:

OTREMBA, RALF

Exec Dt:

09/10/2018