Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
07/07/2020
|
Application #:
|
16692115
|
Filing Dt:
|
11/22/2019
|
|
Inventors:
|
HUAN-CHANG TSENG, RONG-YEU CHANG, CHIA-HSIANG HSU
|
|
Title:
|
MOLDING SYSTEM FOR PREPARING FIBERLESS THERMOPLASTIC COMPOSITE ARTICLE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| TAI YUEN HI-TECH INDUSTRIAL PARK 8F-2, NO.32, TAIYUAN ST., |
| CHUPEI CITY, HSINCHU COUNTY,, TAIWAN 30265 |
|
|
|
|
| MUNCY, GEISSLER, OLDS & LOWE, PC |
| 4000 LEGATO ROAD, SUITE 310 |
| FAIRFAX, VA 22033 |
|
|
Search Results as of:
06/01/2024 01:50 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
