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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	10707012	Issue Dt:	07/07/2020	Application #:	14961414	Filing Dt:	12/07/2015
Publication #:	20160172098	Pub Dt:	06/16/2016
Inventors:	Jong Suk JEONG, Kang Heon HUR, Seong Jae LEE, Jung Wook SEO, Hiroyuki MATSUMOTO et al
Title:	CHIP ELECTRONIC COMPONENT

Assignment: 1

Reel/Frame:

037227/0689

Recorded: 12/07/2015

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

JEONG, JONG SUK

Exec Dt:

11/17/2015

HUR, KANG HEON

Exec Dt:

11/24/2015

LEE, SEONG JAE

Exec Dt:

11/17/2015

SEO, JUNG WOOK

Exec Dt:

11/23/2015

MATSUMOTO, HIROYUKI

Exec Dt:

11/18/2015

SIM, CHUL MIN

Exec Dt:

11/17/2015

YOON, JONG SIK

Exec Dt:

11/17/2015

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD.

MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU

TOKYO, JAPAN

Correspondent:

MCDERMOTT WILL & EMERY LLP

THE MCDERMOTT BUILDING

500 NORTH CAPITOL STREET, N.W.

WASHINGTON, DC 20001

Assignment: 2

Reel/Frame:

052766/0848

Recorded: 05/27/2020

Pages: 6

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY CITY AND STATE PREVIOUSLY RECORDED AT REEL: 37227 FRAME: 689. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.

Assignors:

JEONG, JONG SUK

Exec Dt:

11/17/2015