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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10710657
Issue Dt:
07/14/2020
Application #:
15892494
Filing Dt:
02/09/2018
Publication #:
20180257722
Pub Dt:
09/13/2018
Inventors:
Atsushi Osada, Takeshi Hara, Hideari Kamachi, Takeshi Iura, Hiroki Sakabe, Shinji Sawada
Title:
SUSPENSION ASSEMBLY MOUNTING METHOD
Assignment: 1
Reel/Frame:
044881/0052Recorded: 02/09/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
OSADA, ATSUSHI
Exec Dt:
11/22/2017
HARA, TAKESHI
Exec Dt:
11/24/2017
KAMACHI, HIDEARI
Exec Dt:
11/22/2017
IURA, TAKESHI
Exec Dt:
12/26/2017
SAKABE, HIROKI
Exec Dt:
11/22/2017
SAWADA, SHINJI
Exec Dt:
11/22/2017
Assignee:
HONDA MOTOR CO., LTD.
1-1, MINAMI-AOYAMA 2-CHOME
MINATO-KU
TOKYO, JAPAN 107-8556
Correspondent:
RANKIN HILL AND CLARK LLP
38210 GLENN AVENUE
WILLOUGHBY, OH 44094

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