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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10714334
Issue Dt:
07/14/2020
Application #:
15860354
Filing Dt:
01/02/2018
Publication #:
20190164747
Pub Dt:
05/30/2019
Inventors:
Cheng-Wei CHANG, Chun-chieh WANG, Min-Hsiu HUNG, Huang-Yi HUANG, Yu-Ting LIN
Title:
CONDUCTIVE FEATURE FORMATION AND STRUCTURE
Assignment: 1
Reel/Frame:
045117/0116Recorded: 03/06/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHANG, CHENG-WEI
Exec Dt:
01/15/2018
HUANG, HUANG-YI
Exec Dt:
01/15/2018
WANG, CHUN-CHIEH
Exec Dt:
01/15/2018
LIN, YU-TING
Exec Dt:
01/15/2018
HUNG, MIN-HSIU
Exec Dt:
01/15/2018
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondent:
PATTERSON & SHERIDAN, LLP
24 GREENWAY PLAZA
SUITE 1600
HOUSTON, TX 77046
Assignment: 2
Reel/Frame:
053476/0379Recorded: 08/12/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHANG, CHENG-WEI
Exec Dt:
07/21/2020
HUNG, MIN-HSIU
Exec Dt:
07/22/2020
HUANG, HUNG-YI
Exec Dt:
07/22/2020
WANG, CHUN CHIEH
Exec Dt:
07/21/2020
LIN, YU-TING
Exec Dt:
07/24/2020
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP/TSMC
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252

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