Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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07/14/2020
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Application #:
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15921852
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Filing Dt:
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03/15/2018
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Publication #:
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Pub Dt:
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09/19/2019
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Inventors:
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Wolfgang Sauter, Mark W. Kuemerle, Eric W. Tremble, David B. Stone et al
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Title:
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INTERCONNECTED INTEGRATED CIRCUIT (IC) CHIP STRUCTURE AND PACKAGING AND METHOD OF FORMING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O BOX 309 |
| UGLAND HOUSE |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1104 |
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| HOFFMAN WARNICK LLC |
| 540 BROADWAY |
| ALBANY, NY 12207 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2600 GREAT AMERICA WAY |
| SANTA CLARA, CALIFORNIA 95054 |
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| GLOBALFOUNDRIES SINGAPORE PTE. LTD. |
| 60 WOODLANDS INDUSTRIAL PARK D STREET 2, |
| SINGAPORE, 738406 SINGAPORE |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 440 STONE BREAK ROAD EXTENSION |
| MALTA, NEW YORK 12020 |
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| BENJAMIN PETERSEN |
| 1460 EL CAMINO REAL, 2ND FLOOR |
| SHEARMAN & STERLING LLP |
| MENLO PARK, CA 94025 |
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