Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/14/2020
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Application #:
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15995176
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Filing Dt:
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06/01/2018
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Publication #:
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Pub Dt:
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08/08/2019
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Inventors:
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Doo Jin Kim, Young Sik Kim
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| VOLENTINE, WHITT & FRANCOS, PLLC |
| 11951 FREEDOM DRIVE, SUITE 1300 |
| RESTON, VA 20190 |
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