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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/21/2020
Application #:
16085021
Filing Dt:
09/14/2018
Publication #:
Pub Dt:
03/21/2019
Inventors:
Seung Uk Yeu, Hyunwoo Kim, Yujin Cha
Title:
Latex Composition For Dip Molding, And Molded Product Manufactured Therefrom
Assignment: 1
Reel/Frame:
046913/0378Recorded: 09/19/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/03/2018
Exec Dt:
08/03/2018
Exec Dt:
08/09/2018
Assignee:
128, YEOUI-DAERO
YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 07336
Correspondent:
LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP
600 SOUTH AVENUE WEST
WESTFIELD, NJ 07090

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