Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/21/2020
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Application #:
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16172966
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Filing Dt:
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10/29/2018
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Publication #:
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Pub Dt:
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11/21/2019
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Inventors:
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JIAN-RU CHEN, JO-WEI YANG, CHUNG-HSIEN HSIN, HSIU-WEN TU
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Title:
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SENSOR PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.84, TAI-HO RD., CHU-PEI |
HSIN-CHU COUNTY, TAIWAN 302 |
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
3057 NUTLEY STREET |
SUITE 818 |
FAIRFAX, VA 22031 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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6F., NO. 83, YANPING S. RD., ZHONGZHENG DIST. |
TAIPEI CITY, TAIWAN 100011 |
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MCCLURE, QUALEY & RODACK LLP |
280 INTERSTATE NORTH CIRCLE |
SUITE 550 |
ATLANTA, GA 30339 |
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10/31/2024 06:58 PM
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