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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/21/2020
Application #:
16172966
Filing Dt:
10/29/2018
Publication #:
Pub Dt:
11/21/2019
Inventors:
JIAN-RU CHEN, JO-WEI YANG, CHUNG-HSIEN HSIN, HSIU-WEN TU
Title:
SENSOR PACKAGE STRUCTURE
Assignment: 1
Reel/Frame:
047335/0919Recorded: 10/29/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/24/2018
Exec Dt:
10/24/2018
Exec Dt:
10/24/2018
Exec Dt:
10/24/2018
Assignee:
NO.84, TAI-HO RD., CHU-PEI
HSIN-CHU COUNTY, TAIWAN 302
Correspondent:
LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE
3057 NUTLEY STREET
SUITE 818
FAIRFAX, VA 22031
Assignment: 2
Reel/Frame:
062119/0661Recorded: 12/14/2022Pages: 13
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/26/2022
Assignee:
6F., NO. 83, YANPING S. RD., ZHONGZHENG DIST.
TAIPEI CITY, TAIWAN 100011
Correspondent:
MCCLURE, QUALEY & RODACK LLP
280 INTERSTATE NORTH CIRCLE
SUITE 550
ATLANTA, GA 30339

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