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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10734292
Issue Dt:
08/04/2020
Application #:
16206771
Filing Dt:
11/30/2018
Publication #:
20190115266
Pub Dt:
04/18/2019
Inventors:
Meng-Han LIN, Chia-Lin LIANG, Chih-Ren HSIEH
Title:
METHOD FOR TESTING BRIDGING IN ADJACENT SEMICONDUCTOR DEVICES AND TEST STRUCTURE
Assignment: 1
Reel/Frame:
047645/0689Recorded: 11/30/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LIN, MENG-HAN
Exec Dt:
11/06/2017
LIANG, CHIA-LIN
Exec Dt:
11/06/2017
HSIEH, CHIH-REN
Exec Dt:
11/06/2017
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001
Assignment: 2
Reel/Frame:
047762/0407Recorded: 12/10/2018Pages: 7
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE ASSIGNEE'S NAME PREVIOUSLY RECORDED ON REEL 047645 FRAME 0689. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
LIN, MENG-HAN
Exec Dt:
11/06/2017
LIANG, CHIA-LIN
Exec Dt:
11/06/2017
HSIEH, CHIH-REN
Exec Dt:
11/06/2017
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8 LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET NW
WASHINGTON, DC 20001

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