Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
|
Issue Dt:
|
08/04/2020
|
Application #:
|
16018635
|
Filing Dt:
|
06/26/2018
|
Publication #:
|
|
Pub Dt:
|
05/16/2019
| | | | |
Inventors:
|
Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Yun Rou Lim
|
Title:
|
FOLDED SEMICONDUCTOR PACKAGE ARCHITECTURES AND METHODS OF ASSEMBLING SAME
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95054 |
|
|
|
SCHWEGMAN, LUNDBERG & WOESSNER/INTEL |
PO BOX 2938 |
MINNEAPOLIS, MN 55402 |
|
|
Assignment:
2
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
BLANCHARDSTOWN CORPORATE PARK 2 |
PLAZA 255, SUITE 2A |
DUBLIN, IRELAND D15 YH6H |
|
|
|
TAHOE RESEARCH, LTD. |
BLANCHARDSTOWN CORPORATE PARK 2 |
PLAZA 255, SUITE 2A |
DUBLIN, D15 YH6H IRELAND |
|
|
Search Results as of:
05/10/2024 03:05 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|