Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/25/2020
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Application #:
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15804135
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Filing Dt:
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11/06/2017
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Publication #:
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Pub Dt:
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10/18/2018
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Inventors:
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Minhyuck KANG, Yukihiro MIYAZAWA, Myeonghee KIM, Jungwoo PARK, Atsushi TAKAKUWA et al
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Title:
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COMPOSITION FOR SOFT MOLD AND SOFT MOLD MANUFACTURED BY USING THE COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, SAMSUNG-RO, GIHEUNG-GU |
| YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 17113 |
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| INNOVATION COUNSEL LLP |
| 2890 ZANKER ROAD, SUITE 200 |
| SAN JOSE, CA 95134 |
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