Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/15/2020
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Application #:
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16404949
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Filing Dt:
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05/07/2019
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Publication #:
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Pub Dt:
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08/22/2019
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Inventors:
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CHARLES L. ARVIN, STEVEN P. OSTRANDER, KRISHNA R. TUNGA
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Title:
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MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORP. - FISHKILL DRAFTING CENTER IP |
| 2455 SOUTH ROAD |
| M/S P386 BLDG. 008-2 |
| POUGHKEEPSIE, NY 12601 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1891 ROBERSTON ROAD |
| SUITE 100 |
| OTTAWA, CANADA K2H 5B7 |
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| ELPIS TECHNOLOGIES INC. |
| 1891 ROBERSTON ROAD |
| SUITE 100 |
| OTTAWA, K2H 5B7 CANADA |
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