Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/15/2020
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Application #:
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15396909
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Filing Dt:
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01/03/2017
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Publication #:
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Pub Dt:
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05/31/2018
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Inventors:
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Jian-Hong Lin, Kuo-Yen Liu, Hsin-Chun Chang, Tzu-Li Lee, Yu-Ching Lee, Yih-Ching Wang
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Title:
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SEMICONDUCTOR DEVICE INCLUDING DUMMY VIA ANCHORED TO DUMMY METAL LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN 300 |
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MCCLURE, QUALEY & RODACK, LLP |
3100 INTERSTATE NORTH CIRCLE |
SUITE 150 |
ATLANTA, GA 30339 |
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