Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/29/2020
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Application #:
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16398245
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Filing Dt:
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04/29/2019
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Publication #:
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Pub Dt:
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06/11/2020
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Inventors:
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Sheng-Fan YANG, Yuan-Hung LIN, Yu-Cheng SUN, Steve S.A. WAN
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Title:
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INTEGRATED CIRCUIT PACKAGE ELEMENT AND LOAD BOARD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 10, LI-HSIN 6TH ROAD, HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN 30078 |
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| NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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| CKC & PARTNERS CO., LLC |
| 12345 LAKE CITY WAY NE, NO. 283 |
| SEATTLE, WA 98125 |
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