Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/13/2020
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Application #:
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15720374
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Filing Dt:
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09/29/2017
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Publication #:
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Pub Dt:
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04/04/2019
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Inventors:
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Stephen Roy Gilbert, Martin Franosch, Suresh Sridaran, Andrew Thomas Barfknecht et al
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Title:
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POLYMER LID WAFER-LEVEL PACKAGE WITH AN ELECTRICALLY AND THERMALLY CONDUCTIVE PILLAR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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| AVAGO TECHNOLOGIES, LTD. |
| 4380 ZIEGLER ROAD |
| FORT COLLINS, CO 80525 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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| FOLEY & LARDNER LLP/ BROADCOM CORPORATIO |
| 3000 K STREET N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007-5109 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF THE MERGER AND APPLICATION NOS. 13/237,550 AND 16/103,107 FROM THE MERGER PREVIOUSLY RECORDED ON REEL 047231 FRAME 0369. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER.
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| 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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| FOLEY & LARDNER LLP/ BROADCOM CORPORATION |
| 3000 K STREET N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007-5109 |
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