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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	10806030	Issue Dt:	10/13/2020	Application #:	14597730	Filing Dt:	01/15/2015
Publication #:	20160211481	Pub Dt:	07/21/2016
Inventors:	Jean AUDET, Masahiro FUKUI, Charles L. REYNOLDS, Tomoyuki YAMADA, Edmund D. BLACKSHEAR et al
Title:	MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARRIER FOR ELECTRICAL PERFORMANCE

Assignment: 1

Reel/Frame:

034727/0832

Recorded: 01/15/2015

Pages: 6

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

AUDET, JEAN

Exec Dt:

05/21/2014

BLACKSHEAR, EDMUND D.

Exec Dt:

05/28/2014

FUKUI, MASAHIRO

Exec Dt:

01/09/2015

REYNOLDS, CHARLES L.

Exec Dt:

05/28/2014

TERADA, KENJI

Exec Dt:

01/09/2015

YAMADA, TOMOYUKI

Exec Dt:

01/08/2015

Assignees:

INTERNATIONAL BUSINESS MACHINES CORPORATION

NEW ORCHARD ROAD

ARMONK, NEW YORK 10504

KYOCERA CIRCUIT SOLUTIONS INC.

656 ICHIMIYAKE

YASU-CITY, SHIGA, JAPAN 520-2362

Correspondent:

ANDREW M. CALDERON

7918 JONES BRANCH DRIVE, SUITE 500

MCLEAN, VA 22102

Assignment: 2

Reel/Frame:

034853/0876

Recorded: 01/29/2015

Pages: 8

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF THE ASSIGNMENT-DECLARATION FOR INVENTOR JEAN AUDET PREVIOUSLY RECORDED ON REEL 034727 FRAME 0832. ASSIGNOR(S) HEREBY CONFIRMS THE DATE OF THE EXECUTION OF THE ASSIGNMENT-DECLARATION IS MAY 27, 2014.

Assignors:

AUDET, JEAN

Exec Dt:

05/27/2014